供应新益昌HDB852P固晶机

适用于2121,3014及2835,5050等


.系统功能/System Function

4、吸晶摆臂机械手系统/

Die Bonder’s Swing Arm-and-hand system

生产周期/Production Cycle

50ms

周期取决于晶片尺寸及支架(Depending On Die Size And Holder)

吸晶摆臂/Swing Arm of Die Bonder

90°可旋转固晶(Rotatable Die Bond)

XY位置精度/Accuracy

±1mil(±0.025mm）

吸晶压力/Die Bond Pressure

可调20g—250g(Adjustable)

芯片旋转/Die Rotation

±1°

5.送料工作平台/Loading Workbench

2.芯片XY工作台/Die XY Workbench

行程范围/Range of Stroke

170mm*75mm

芯片尺寸/Die Dimensions

3mil×3mil-80mil×80mil
(0.076mm*0.076mm-2mm*2mm)

XY分辨率/XY Resolution

0.02mil(0.5μm)

6.适用支架尺寸/Suitable Holder’s Size

晶片较大角度修正/Max.Angle Correction

±15°

支架长度/Length

120mm ~ 170mm

较大芯片环尺寸/Max.Die Ring Size

6″（152mm）外径(External Diameter)

支架宽度/Width

48mm~ 75mm

较大芯片面积尺寸/Max.Die Area

4.7″（119mm）扩张后(Expanded)

7.所需设施/Facilities Needed

分辨率/Resolution Ratio

0.04mil  (1μm)

电压/频率/Voltage/Frequency

220V AC±5%/50HZ

顶针Z高度行程/Thimble Z Height Stroke

80mil（2mm）

压缩空气/Compressed Air

0.5MPa（MIN）

额定功率/Rated Power

950W

3.图像识别系统/Image Recognition System

耗气量/Gas Consumption

5L/min

灰阶度/Grey Scale

256级灰度(Level Grey)

8.体积及重量/Volume and Weight

分辨率/Resolution

656×492像素(Pixels)

长x宽x高/Length x Width x Height

170×100×180cm

图像识别精准度/Image Recognition Accuracy

±0.025mil@50mil观测范围(Observation Range)